6 Layer ENIG PCB Manufacturer | High Quality Factory Direct Pricing

Product Detail

Layers	6 layers
Board thickness	1.60MM
Material	FR4 tg170
Copper thickness	1/1/1/1/1/1 OZ(35um)
Surface Finish	ENIG Au Thickness 0.15um; Ni Thickness 3um
Min Hole(mm)	0.15mm
Min Line Width(mm)	0.15mm
Min Line Space(mm)	0.15mm
Solder Mask	Blue
Legend Color	White
Mechanical processing	V-scoring, CNC Milling(routing)
Packing	Anti-static bag
E-test	Flying probe or Fixture
Acceptance standard	IPC-A-600H Class 2
Application	Automotive electronics

Product Material As a supplier of various PCB technologies, volumes, lead time options, we have a selection of standard materials with which a large bandwidth of the variety of types of PCB can be covered and which are always available in house. Requirements for other or for special materials can also be met in most cases, but, depending upon the exact requirements, up to about 10 working days may be needed to procure the material. Do get in touch with us and discuss your needs with one of our sales or CAM team. Standard materials held in stock:

Components	Thickness	Tolerance	Weave type
Internal layers	0,05mm	+/-10%	106
Internal layers	0.10mm	+/-10%	2116
Internal layers	0,13mm	+/-10%	1504
Internal layers	0,15mm	+/-10%	1501
Internal layers	0.20mm	+/-10%	7628
Internal layers	0,25mm	+/-10%	2 x 1504
Internal layers	0.30mm	+/-10%	2 x 1501
Internal layers	0.36mm	+/-10%	2 x 7628
Internal layers	0,41mm	+/-10%	2 x 7628
Internal layers	0,51mm	+/-10%	3 x 7628/2116
Internal layers	0,61mm	+/-10%	3 x 7628
Internal layers	0.71mm	+/-10%	4 x 7628
Internal layers	0,80mm	+/-10%	4 x 7628/1080
Internal layers	1,0mm	+/-10%	5 x7628/2116
Internal layers	1,2mm	+/-10%	6 x7628/2116
Internal layers	1,55mm	+/-10%	8 x7628
Prepregs	0.058mm*	Depends on layout	106
Prepregs	0.084mm*	Depends on layout	1080
Prepregs	0.112mm*	Depends on layout	2116
Prepregs	0.205mm*	Depends on layout	7628

Cu thickness for internal layers: Standard - 18µm and 35 µm, on request 70 µm, 105µm and 140µm Material type: FR4 Tg: approx. 150°C, 170°C, 180°C εr at 1 MHz: ≤5,4 (typical: 4,7) More available on request Stackup The main 6 layer stackup configuration will be generally as below: ·Top ·Inner ·Ground ·Power ·Inner ·Bottom